InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration

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July 15, 2025 – Hsinchu, Taiwan —InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC’s Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement…

InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications

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[March 14, 2025, Hsinchu, Taiwan] – InPsytech, Inc., a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis Group, is pleased to announce its participation in the Intel Foundry Accelerator IP Alliance. The collaboration will bring InPsytech’s advanced IP offerings to the Intel Foundry ecosystem, enabling mutual customers to design their semiconductor products…