Egis Group Showcases Cutting-Edge Innovations at 2025 Egis Tech Day

3nm Heterogeneous Computing, 6nm AI Chiplet, and Next-Generation AI Vision Platform Unveiled—Leading a New Era of AI Computing Power Taipei, Taiwan — October 28, 2025 — Egis Technology Inc. (6462.TWO) today hosted its “2025 Egis Tech Day” at the Taipei Marriott Hotel under the theme “AI in Full Motion.” The event brought together Egis subsidiaries…

InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025, Accelerating Innovation in Chiplet Ecosystem

(October 13, 2025, Taipei) — InPsytech, a subsidiary of Egis Technology (6462.TWO) specializing in high-speed interface intellectual property (IP) development, announced today that it will participate in the Open Compute Project (OCP) Global Summit 2025, to be held in San Jose, California, from October 13–16, 2025. At the event, InPsytech will showcase its latest 3nm…

InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration

July 15, 2025 – Hsinchu, Taiwan —InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC’s Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement…

InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications

[March 14, 2025, Hsinchu, Taiwan] – InPsytech, Inc., a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis Group, is pleased to announce its participation in the Intel Foundry Accelerator IP Alliance. The collaboration will bring InPsytech’s advanced IP offerings to the Intel Foundry ecosystem, enabling mutual customers to design their semiconductor products…