A Global Fabless Semiconductor Group Offering Connectivity IPs and Chiplet Design Turnkey Services

Egis touch sensor gives you a fast, convenient, and secure way to pay with just one touch.

Dynamic and real time sensor calibration for both wet and dry fingers

The only passive type fingerprint sensor available on the market.

Proprietary matcher enables 360 degree fingerprint authentication.

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FIDO technology specifications and protocols offer its users the options of using an easy–to–use, strongly–secure open standards–based 2nd factor device for authentication.

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Egis authentication uses FIDO certified products to provide end-to-end authentication for payment with high security.

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InPsytech's solutions are designed to support smart vehicles, advanced driver-assistance systems (ADAS), and autonomous driving applications.

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The smallest fingerprint touch module available on the market, suitable for replacing the mobile home button or the volume key. Smallest fingerprint/navigation sensor module, sole source on the market

Egis Breaking News

Egis makes initial strides in South Korea as InPsytech joins SAFE

InPsytech, a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis, has beenselected to join the Samsung Advanced Foundry Ecosystem (SAFE) as an IP partner. This recognition stems from InPsytech’soutstanding performance in open NAND flash interface (ONFI) high-performance IP solutions. InPsytech plans to continueexpanding its IP portfolio within Samsung’s ecosystem, particularly by strengthening applications for UCIe IP.
────DIGITIMES Asia   2025.05.19

Egis Technology Partners with ASICLAND to Accelerate Global AI HPC Server Chip Deployment

[November 5, 2024, Taipei] Egis Technology has signed a strategic partnership agreement with South Korean chip design company, ASICLAND Co., Ltd., to co-develop AI HPC Server Chiplet designs. This collaboration encompasses multiple key technologies, including CPU Die, AI Die, IO Die, IP licensing (such as UCIe, LPDDR5, PCIE5/6), and advanced CoWoS packaging development, all aimed at the high-end data center market.
────Egis Technology Inc.,   2024.11.05