Barcelona, Spain — March 2, 2026 — At MWC Barcelona 2026 (March 2–5), EGIS TECHNOLOGY INC. will present an integrated space-to-ground connectivity and Physical AI platform at Booth 1C32, together…
Figure 1 | Creative5 hybrid IoT smart forestry monitoring nodes deployed in forest areas at National Ilan University (NIU), Taiwan. The system integrates NTN satellite connectivity with terrestrial networks, LoRaWAN,…
3nm Heterogeneous Computing, 6nm AI Chiplet, and Next-Generation AI Vision Platform Unveiled—Leading a New Era of AI Computing Power Taipei, Taiwan — October 28, 2025 — Egis Technology Inc. (6462.TWO)…
(October 13, 2025, Taipei) — InPsytech, a subsidiary of Egis Technology (6462.TWO) specializing in high-speed interface intellectual property (IP) development, announced today that it will participate in the Open Compute…
July 15, 2025 – Hsinchu, Taiwan —InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its…
[March 14, 2025, Hsinchu, Taiwan] – InPsytech, Inc., a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis Group, is pleased to announce its participation in the Intel…
[November 5, 2024, Taipei] Egis Technology has signed a strategic partnership agreement with South Korean chip design company, ASICLAND Co., Ltd., to co-develop AI HPC Server Chiplet designs. This collaboration…
[Taiwan, October 25, 2024] — InPsytech, Inc., a leading high-speed interface IP company, announced today that its ONFI 4,800 MT/s IP, designed according to the JESD 230G standard, has successfully…
Taipei, Taiwan – October 15, 2024 – Egis Technology (6462.TWO), a member of the Egis Group, together with Alcor Micro Corp. (8054.TWO), announced on October 15th that it will join…
