Creative5 and Viasat Pioneer Smart Forestry Monitoring through Hybrid Satellite IoT at CES 2026

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Figure 1 | Creative5 hybrid IoT smart forestry monitoring nodes deployed in forest areas at National Ilan University (NIU), Taiwan. The system integrates NTN satellite connectivity with terrestrial networks, LoRaWAN, and BLE Mesh, combined with solar power and ultra-low-power design to enable long-term, reliable environmental sensing in remote and infrastructure-limited forest environments.   Creative5 and…

Egis Group Showcases Cutting-Edge Innovations at 2025 Egis Tech Day

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3nm Heterogeneous Computing, 6nm AI Chiplet, and Next-Generation AI Vision Platform Unveiled—Leading a New Era of AI Computing Power Taipei, Taiwan — October 28, 2025 — Egis Technology Inc. (6462.TWO) today hosted its “2025 Egis Tech Day” at the Taipei Marriott Hotel under the theme “AI in Full Motion.” The event brought together Egis subsidiaries…

InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025, Accelerating Innovation in Chiplet Ecosystem

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(October 13, 2025, Taipei) — InPsytech, a subsidiary of Egis Technology (6462.TWO) specializing in high-speed interface intellectual property (IP) development, announced today that it will participate in the Open Compute Project (OCP) Global Summit 2025, to be held in San Jose, California, from October 13–16, 2025. At the event, InPsytech will showcase its latest 3nm…

InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration

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July 15, 2025 – Hsinchu, Taiwan —InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC’s Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement…

InPsytech Joins Intel Foundry Accelerator IP Alliance to Boost HPC, AI, And Automotive Applications

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[March 14, 2025, Hsinchu, Taiwan] – InPsytech, Inc., a leading provider of high-performance semiconductor intellectual property (IP) solutions under Egis Group, is pleased to announce its participation in the Intel Foundry Accelerator IP Alliance. The collaboration will bring InPsytech’s advanced IP offerings to the Intel Foundry ecosystem, enabling mutual customers to design their semiconductor products…

Egis Technology Partners with ASICLAND to Accelerate Global AI HPC Server Chip Deployment

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[November 5, 2024, Taipei] Egis Technology has signed a strategic partnership agreement with South Korean chip design company, ASICLAND Co., Ltd., to co-develop AI HPC Server Chiplet designs. This collaboration encompasses multiple key technologies, including CPU Die, AI Die, IO Die, IP licensing (such as UCIe, LPDDR5, PCIE5/6), and advanced CoWoS packaging development, all aimed…

InPsytech, Inc. (Egis Group) Successfully Verifies ONFI PHY IP at 4,800 MT/s to Drive High-Speed Storage Applications

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[Taiwan, October 25, 2024] — InPsytech, Inc., a leading high-speed interface IP company, announced today that its ONFI 4,800 MT/s IP, designed according to the JESD 230G standard, has successfully passed silicon validation on N6/N7 nodes. This comprehensive ONFI IP solution includes complete IO, PHY, and PLL designs, marking a significant milestone in the high-speed…

Egis Technology enters into an exclusive partnership agreement with Fingerprint Cards AB (publ) in the Mobile area, covering patent, technology, and product licensing

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Taipei, Taiwan – June 13, 2024 Egis Technology enters into an exclusive partnership agreement with Fingerprint Cards AB (publ) in the Mobile area, covering patent, technology, and product licensing Egis Technology (“Egis”) today announced that it has entered into an exclusive partnership agreement with Fingerprint Cards AB (Fingerprints), one of the largest biometric sensor solution…