About

Egis, a global fabless semiconductor group offering semiconductor products, connectivity IPs and chiplet design turnkey services, is utilizing the Arm Neoverse CSS V3 platform to develop a compute die targeted towards AI server applications. This compute die is intended to work in conjunction with a wide variety of AI accelerator die offerings in the market and will also feature Egis’ market leading connectivity IPs such as UCie and PCie embedded inside.

As an IP company, Egis’s main IP UCIe is the only mass-produced one in the world. It has been verified by American Tier1 CSP customers and is the most power-saving and lowest-latency, and fastest-transmission UCIe IP. In addition, Egis’ IP focuses on IP that provides high-speed, short-range transmission based on DDR architecture, not only UCIe, but also DDR, LPDDR, ONFI, etc. There is also the Foundation IP series to optimize chip performance, reduce energy consumption and reduce chip size.

Alcor is a chiplet design turnkey solution company. Different from traditional design service companies, it can provide design turnkey solution from single chip design to system-level chiplet design turnkey services that connect multiple chips through UCIe and advanced packaging. Its design experience includes 3/4/5/6/7nm to mature processes, and not only general SoC, but also large chip design such as AI accelerator, and has rich experience in CoWoS / WoW / SoIC turnkey services. Alcor Micro’s cutting-edge design service capabilities are combined with Egis UCIe IP to build scalable, high-performance, power-saving CSS V3 32Cores CPU chips.