Barcelona, Spain — March 2, 2026 — At MWC Barcelona 2026 (March 2–5), EGIS TECHNOLOGY INC. will present an integrated space-to-ground connectivity and Physical AI platform at Booth 1C32, together with group companies ALGOLTEK, INC., ENE TECHNOLOGY INC., CREATIVE5 INC., ICATCH TECHNOLOGY, INC., SYNCOMM TECHNOLOGY CORPORATION, ALCORMICRO CORP., and EGIS VISION INC. etc.
The group’s focus: connecting satellites, AI perception, UAV systems, chiplet computing, and ultra-low-latency communications into a deployable architecture for intelligent inspection and autonomous systems.
As 5G-Advanced and 3GPP NTN (Non-Terrestrial Networks) move toward commercialization, hybrid satellite-terrestrial connectivity is becoming operational infrastructure rather than experimental technology. At the same time, Physical AI—AI that perceives and acts in real-world environments—is driving demand for low-latency sensing, computing, and transmission.
Egis Group is positioning itself at the intersection of those two shifts.
Cross-Orbit Hybrid Satellite IoT
CREATIVE5 INC. will showcase its Hybrid Satellite IoT architecture integrating:
‧ 3GPP NTN multi-orbit satellite systems (GEO and LEO)
‧ LoRaWAN
‧ BLE Mesh
‧ DECT NR+
The platform enables seamless switching between terrestrial and satellite networks. Target use cases include disaster response, remote inspection, energy infrastructure monitoring, and automotive NTN connectivity.
Solutions on display include satellite-based SOS emergency nodes, UAV hybrid satellite communications, and hybrid satellite terminal devices designed for field deployment.
The objective: resilient global coverage where terrestrial networks are unavailable or unstable.
Multimodal AI Perception at Millisecond Latency
To support autonomous drones and robotics, low-latency perception is critical.
ALGOLTEK, INC., in collaboration with APPRO PHOTOELECTRON INC., will demonstrate its next-generation “AI Eye” multimodal perception system built on NVIDIA Jetson Thor.
The system integrates ICATCH TECHNOLOGY, INC.’s PAISB (Physical AI Sensor Bridge), designed for high-speed image bridging and optimized data flow.
By combining RGB, DVS, and ToF sensing with edge AI inference, the platform performs sensing, recognition, and motion prediction at millisecond-level responsiveness.
Capabilities include:
‧ Real-time obstacle avoidance in high-speed environments
‧ Depth sensing for complex navigation
‧ Stable recognition under extreme lighting conditions
‧ Digital twin integration into real-world AI deployments
The architecture is designed as a visual core for UAV and robotics platforms operating in constrained or dynamic environments.
From IC Design to Full UAV System Integration
ENE TECHNOLOGY INC. will debut a fully integrated UAV platform at MWC, marking its expansion from semiconductor IC design into intelligent flight system integration.
The platform combines:
‧ Satellite communication modules from CREATIVE5
‧ Unified mapping-and-control ground station
‧ ALGOLTEK visual perception algorithms
‧ ICATCH high-speed imaging bridge
‧ APPRO imaging integration
The system supports stable control and ultra-low-latency HD video return, even in signal-constrained or long-distance missions.
ENE will also demonstrate the ENE Inspector lightweight UAV, designed for indoor facilities, narrow corridors, and underground utility tunnels. Sensor fusion and coordinated flight control improve autonomous navigation and operational safety in confined environments.
Arm-Based CSS CPU Chiplet Architecture
On the computing side, ALCORMICRO CORP. will present its Arm-based CSS CPU chiplet direction through its Mobius100 design.
Built using Arm CSS V3 CPU IP, UCIe interconnect technology from Inpsytech, Inc., and advanced process technology, the architecture targets compliance with Arm Chiplet System Architecture and future OCP specifications.
At MWC, ALCORMICRO will demonstrate chiplet interconnect transmission and compute capabilities in a simulation environment, emphasizing high-bandwidth, scalable interconnect design.
The architecture is intended to interface directly with AI accelerator chiplets and support heterogeneous multi-chip computing systems—extending into Physical AI applications across the group’s ecosystem.
1ms Ultra-Low-Latency Wireless Transmission
For Physical AI systems, communication delay can limit performance.
SYNCOMM TECHNOLOGY CORPORATION will showcase FalneX, an ultra-low-latency wireless transmission solution delivering:
‧ As low as 1ms transmission latency
‧ 60fps wireless HD video streaming
The technology is designed for drones and robotics requiring near-synchronous visual feedback and precise remote control.
Applications include real-time obstacle avoidance, teleoperation, and instant inspection video return.
Always-On Ultra-Low-Power AI
EGIS VISION INC. will present an Always-On ultra-low-power context-aware AI chip designed for AI PCs and AIoT devices.
The chip supports user behavior recognition and intelligent power management to extend battery life while maintaining privacy protection.
When paired with low-power wireless modules such as LoRa, the solution enables long-duration AIoT deployments with reduced maintenance requirements.
An Integrated Physical AI and Connectivity Stack
By combining satellite communications, multimodal AI perception, UAV platforms, chiplet-based computing, ultra-low-latency wireless transmission, and ultra-low-power AI chips, Egis Group is building a vertically integrated stack for intelligent inspection and autonomous systems.
The architecture targets applications across:
‧ Remote industrial monitoring
‧ Energy and infrastructure inspection
‧ Disaster response
‧ Smart mobility
‧ AI-enabled robotics
EGIS Group invites international media and industry partners to visit Booth 1C32 at MWC Barcelona 2026 to explore its space-to-ground convergence and Physical AI technologies.
Egis Technology Inc. Acting Spokesperson
Karen Chang
Vice President
+886-2-2658-9768
karen.chang@egistec.com
