Egis Technology Group outlines dual cloud and edge AI strategy targeting 2026 results

2025.12.26

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────Digitimes Egis Technology Group outlines dual cloud and edge AI strategy targeting 2026 results

Egis Technology Group recently held an investor briefing to present its operational outlook for 2026, focusing on a dual approach to cloud AI and edge AI development.
────Digitimes

Egis Technology unveils AI vision, robotics, and 3nm computing platforms at 2025 Tech Day

2025.10.30

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────Digitimes Egis Technology unveils AI vision, robotics, and 3nm computing platforms at 2025 Tech Day

Taiwanese semiconductor group Egis Technology held its annual “2025 Egis Tech Day” on October 28, 2025, unveiling a suite of cutting-edge innovations under the theme of “fully activated AI.”
────Digitimes

OCP Summit: Alcor Micro unveils latest Arm CPU platform for AI and HPC servers

2025.10.14

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────Digitimes OCP Summit: Alcor Micro unveils latest Arm CPU platform for AI and HPC servers

Alcor Micro Corporation, a subsidiary of Egis Technology, is showcasing its latest Arm architecture CPU platform, Mobius100 (CSS V3), at the 2025 Open Compute Project (OCP) Global Summit held October 13–16 in San Jose, California.
────Digitimes

InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025, Accelerating Innovation in Chiplet Ecosystem

2025.10.14

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InPsytech, a subsidiary of Egis Technology (6462.TWO) specializing in high-speed interface intellectual property (IP) development, announced today that it will participate in the Open Compute Project (OCP) Global Summit 2025, to be held in San Jose, California, from October 13–16, 2025.
────Design & Reuse

InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard

2025.07.16

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InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its advanced design for TSMC’s Face-to-Face (F2F) SoIC technology, fully compliant with the UCIE 2.0 (Universal Chiplet Interconnect Express) standard. This milestone marks a significant achievement in enabling high-speed interconnects for heterogeneous chiplet integration.
────Design & Reuse

InPsytech Collaborates with Samsung to Enhance Semiconductor IP

2025.05.16

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────Investors Hangout Samsung to Enhance Semiconductor IP

InPsytech, a renowned provider in the realm of advanced silicon intellectual property (IP) solutions, has recently made headlines by joining the prestigious Samsung SAFE™ IP Partner Program. This initiative, considered one of the highest accolades within Samsung’s Advanced Foundry Ecosystem, emphasizes the company’s commitment to delivering superior ONFI (Open NAND Flash Interface) solutions.
────Investors Hangout

Egis Technology、グローバルAI HPCサーバーチップの実⽤化加速に向けてASICLANDと提携

2024.11.05

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Egis Technologyは、韓国のチップ設計会社であるASICLAND Co., Ltd.と戦略的パートナーシップ契約を締結し、AI HPCサーバーチップレット設計の共同開発を⾏うことを発表しました。この協業には、CPUダイ、AIダイ、IOダイ、IP(UCIe、 LPDDR5、PCIE5/6など)のライセンス供与、および先進的なCoWoSパッケージング開発など、ハイエンドデータセンター市場向けの複数の重要技術が含まれています。
────AFP BB News

Arm Total Design Ignites Growing Ecosystem of Arm

2024.10.15

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────Arm Arm Total Design Ignites Growing Ecosystem of Arm-based Silicon for a Sustainable AI Datacenter

We introduced Arm Total Design a year ago to address these challenges by creating an ecosystem of partners to accelerate the development of custom silicon, bringing together key industry players to build solutions for the datacenters of the future with Arm Compute Subsystems (CSS). It has quickly grown into a multivendor, Arm-based chiplet and SoC ecosystem, bringing together capabilities from design through to foundry manufacturing and doubling to nearly 30 participating companies, with Alcor Micro, Egis, PUF Security and SEMIFIVE as the latest companies to join the ecosystem.
────Arm

Egis Group Announces Strategic Collaboration with Arm

2024.10.15

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Egis Technology (6462.TWO), a member of the Egis Group, together with Alcor Micro Corp. (8054.TWO), announced on October 15th that it will join Arm Total Design, an ecosystem committed to the frictionless delivery of custom SoCs based on Neoverse Compute Subsystems (CSS). This collaboration enables both Egis and Alcor Micro to leverage Neoverse CSS for new chiplet solutions targeting the High-Performance Computing (HPC) and generative AI application markets, combining the strength of Egis’ specialized integrated circuit design and the power efficiency of Arm technology.
────Semiconductor Digest

FIDO seminar highlights security

2024.04.25

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────Taipei Times FIDO seminar highlights security

The first Fast IDentity Online (FIDO) Device Onboard (FDO) seminar, hosted by Academia Sinica, was held yesterday in Taipei, highlighting Taiwan’s status as a hub for the global tech supply chain.
Taiwan’s promotion of “information security equates to national security” aligns with the prevalence of the “zero trust” concept among other foreign governments, as all governments and companies seek to develop more secure networks and systems.
FIDO Alliance members Intel, Dell, Qualcomm, ARM, Amazon, Google and Microsoft have recently jointly completed a proof of concept of a new technology that would help the FIDO Alliance promote a certification program that would encourage all supply chain owners around the globe to begin focusing on Internet of Things (IoT) security.
────Taipei Times

Taiwan’s AI Day 2021 Enters the Metaverse with Virtual Exhibition and Forum

2021.10.29

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────Yahoo Finance Egis secures Hyundai and Kia orders

Two of the forum speakers hail from Taiwan-based IC design firms. Director of Egis Technology (6462:TWO) — a Taiwan-based IC design firm that specializes in fingerprint sensors — TH Po explains how AI is utilized in his company’s latest anti-spoofing technology.
────Yahoo Finance

Egis secures Hyundai and Kia orders

2021.07.14

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Egis Technology Inc (神盾), the world’s second-biggest fingerprint sensor supplier, July 13th said that it has secured orders to supply its products to South Korea’s Hyundai Motor Co and its affiliate, Kia Motors Corp, in its latest bid to expand its presence in the higher-margin automotive components segment.
────Taipei Times

Acer to acquire stake in touch controller supplier FocalTech

2021.04.19

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Taipei, April 19 (CNA) Acer Inc., one of the leading PC brands in Taiwan, said Monday it is planning to acquire a stake in Taiwanese touch controller designer FocalTech Systems Co. at a cost of up to NT$1.5 billion (US$53.19 million).
Egis said it planned to dispose of its total 33.97 million shares in FocalTech, which was a 16.14 percent stake, and that its board had already approved the decision. According to Egis,the shares would be sold in after-hours block trading to prevent a pummeling of FocalTech’s share price.
────FocusTaiwan

Egis outlook downbeat due to poor smartphone sales

2021.03.18

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Wafer supply constraints also remain an issue and could continue to weigh on the company’s business this year, Egis said.
The company said that it was unable to fulfill some rush orders due to a widespread shortage of key components in the second half of last year.
Egis sources 8-inch wafers from Taiwan Semiconductor Manufacturing Co (TSMC, 台積電) and Samsung Electronics Co.
────Taipei Times

Egis reignites Goodix court battle

2020.09.22

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Fingerprint sensor designer Egis Technology Inc (神盾) said that it has filed a patent infringement lawsuit with Beijing’s Intellectual Property Court against Chinese rival Goodix Technology Inc (匯頂) in a renewed legal battle.
Egis has requested the court to immediately stop Goodix’s practice and destroy all problematic products. It is also seeking 90 million yuan (US$13.24 million) in damages, the statement said.
────Taipei Times