InPsytech Tapes Out F2F SoIC Design Compliant with UCIE 2.0 Standard Enabling High-Speed Interconnects for 3D Heterogeneous Integration
July 15, 2025 – Hsinchu, Taiwan —InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, announced that it has successfully taped out its…
